Fonon DSS Invents Laser Direct Writing

Fonon DSS (Display & Semiconductor Systems), the innovative developer of state-of-the-art, laser scribing, dicing, marking, coating removal, direct patterning, and photo mask repair solutions for the Flat Panel Display (FPD), Semiconductor, Photovoltaic and Electronics industries throughout the world announced the invention of Laser Direct Writing for tracking glass panels.

Traditional methods to mark panels with tracking codes such as mechanical etching or engraving using a Co2 Laser can crack the surface of the glass thereby compromising the overall strength and quality of the glass. These cracks can potentially lead to panel failure issues in the future. Additionally, the marks were not always clear enough to be scanned or read.

Laser Direct Writing is a non-destructive, patent pending laser marking technology which marks glass without damaging the surface while producing a readable image. This process does not require tapes or sprays to make the mark thereby eliminating any cleaning and post processing required with other methods.

“Panel manufacturers have been looking for a better way to mark panels with bar codes and UID marks,” said Maureen McHale, the Corporate Marketing and Public Relations Manager for FononDSS. “Laser Direct Writing creates a black, semi-transparent or gold marking on glass and is ideal for tracking the life of the panel. This process does not damage the glass and ensures readability of the mark.”

Fonon DSS, the cutting edge developer of state-of-the-art, laser scribing, dicing, marking, coating removal, direct patterning, and photo mask repair solutions for the Flat Panel Display (FPD), Semiconductor, Photovoltaic and Electronics industries throughout the world. For more information about Fonon DSS’ systems, please visit http://www.fonondss.com/ or call 407-829-2613.

Media Contact:

Maureen McHale

Zero Width Laser Cutting Technology™ (ZWLCT™)

Fonon Technology International has developed a completely new industrial method known to the world as Zero Width Laser Cutting Technology™ (ZWLCT™). The ZWLCT™ technique uses a laser controlled Power Density profile on the material surface to generate the subsurface forces greater than intermolecular connections. Our patented Zero Width Laser Cutting Technology™ (ZWLCT™) has the highest level of precision known to man. This technology has dramatically improved the substrate separation process, specifically for latest generations (Gen 6, 7, and 8) glass panels for Flat Panel Display (FPD) manufacturing.

The methodology utilizes a non-contact laser induced internal stress to produce a controlled separation. Since the technique is non-contact, the surface degradation associated with mechanical scribe and break is eliminated. Yield loss as a result of particulate damage is also greatly reduced. Cutting substrates in clean room conditions becomes feasible with ZWLCT™ leading to the ability to introduce a production line concept into clean room substrate manufacturing. This has not been possible before because of debris generated during cutting and edge grinding which will not be generated during ZWLCT™ processing. In addition, cleaning facilities can also be substantially reduced. These factors offer a cost effective solution to manufacturing space and efficiency.

Our latest mathematical modeling and empirical data gathering resulted in the development of an improved method and the requisite industrial machinery to enable us to introduce these improvements into the FPD industry. With this new method we can create internal tensile forces so great that we can achieve total separation of display type glass WITHOUT COOLING. Under these conditions the MicroCrack™ would propagate in the glass body at a depth of more than 0.7 mm (for bare glass). This process is called Full Body Separation.

The ZWLCT™ method incorporates cooling of the glass surface following controlled heating, with the correct power density profile, this creates the intermolecular separation of the glass substrate to a certain depth. Depth ( t ) has an inverse relation to the speed ( v ) of cutting, assuming that power ( P ) is constant. This means that the slower the speed the deeper the MicroCrack™ that is formed. Both mathematical models and empirical data support these conclusions and field experience has verified these findings.

Zero Width Laser Cutting Technology™ is the only technology available in the world with a NON DIMENSIONAL cutting line. The waste material by the cutting process is totally eliminated.

IC Chip Failure Analysis System

Fonon DSS (Display & Semiconductor Systems), the cutting edge developer of state-of-the-art, laser scribing, dicing, marking, coating removal, direct patterning, and photo mask repair solutions to the Flat Panel Display (FPD), Semiconductor, Photovoltaic and Electronics industries throughout the world announced today the release of the improved FiberTower™ DFAS IC chip package failure analysis system.

The FiberTower™ DFAS uses laser technology to allow an operator to remove individual layers of the mold compound all the way through to the substrate. The DFAS operator can chose to remove the entire compound, individual layers, or sections of the mold compound ranging from the entire sample to just one wire due to the precision of the laser spot positioning. The FiberTower™ DFAS can import images from a variety of testing processes such as SAM, X-Ray, and SEM to show the operator exactly the area of concern within the sample.

Most failure analysis labs use time consuming chemical and mechanical etching processes on a routine basis to dissect chips to see why they failed. Unlike the uncontrollable, wet, chemical etch process, the DFAS IC chip decapitation process is 100% controllable by the operator through a Graphic User Interface (GUI). Utilizing the laser equipped DFAS, the operator can select a specific area to examine instead of dissecting the whole chip as chemical and mechanical etchers must do.

Traditionally, diamond saws were used for processes commonly used in failure analysis. This process is very slow requiring a significant amount of time for additional polishing due to the large standoff required from the cut, and still does not guarantee that the sample will not be damaged. The DFAS utilizes a Fonon’s laser wafer ablation process to provide an extremely accurate dissection without damaging the sample.

The FiberTower™ DFAS also offers a laser spectrometry option to provide a detailed report of all the materials as they are being processed. This feature allows the operator to find inconsistencies within the compound, flow settlement, and contaminants, and provides detail report of the exact characteristics of the mold compound. Improvements to the FiberTower™ DFAS include the use of scan servos with position feedback for higher accuracy and scan see through capabilities for on time inspection.

Eliminating the majority of cost, sample damage, as well as long term health hazards associated with the use of chemicals, the DFAS performs chip failure analysis with unmatched safety, savings, accuracy and speed.

About Fonon DSS: A division of Fonon Technology International, the world renowned inventor and manufacturer of Zero Width Laser Cutting Technology™, Fonon DSS focuses on the semiconductor and flat panel display industries utilizing the patented Zero Width Laser Cutting Technology™ (ZWLCT™) to create products with the highest level of precision. Fonon DSS provides state-of-the-art laser scribing, laser dicing and fiber laser marking solutions to customers in the Flat Panel Display (FPD), Semiconductor and Electronics industries throughout the world. For more information, visit http://www.fonondss.com/ or call 407-829-2613.

Glass Wafer Dicing Technology

As a result of exposure in camera windows and IR filter devices Fonon developed a precision separation of glass panels into individual components with the Zero Width Laser Dicing Technology®.
The ZWLDT® splits materials at the molecular level at tremendous speed with no material loss. This results in the highest edge quality and the fastest dicing speed.

Integrated scribe and break equipment is available for 100 x 100 mm, 200 x 200 and 300 mm in diameter glass substrates mounted on a standard 300 mm wafer hoops.

Quick Release tape made it possible to remove individual substrates from the dicing tape without the edge damage with Pick and Place equipment.

Laser dicing system showing below is a special machine designed for precise dicing of glass wafers.

The Glass Wafer Dicing Process:

• Mount low-tack and quick-release tape on the metal tape frame
• Laminate the substrate on the tape
• Dice the substrate into specified-dimension dies with advanced Zero Width Laser Dicing Technology®
• Apply a cover film
• Flip upside down
• Break with a metal bar
• Expand on stretcher
• Remove individual substrates from dicing tape without edge damage with Pick Place equipment

Applications:

• Bio ID devices
• Cell Phone Cameras and Display Panels
• TFT & LCD Cells
• CCD & IR camera windows
• IR cut off filter

Advantages:

• Higher speeds
• Higher throughput
• High precision and accuracy
• No material loss
• Shortens process and can be brought into clean room
• Edges have a high resistance to breakage

F 250 GL Laser Separation Tool

Lake Mary, Fl., January 30, 2009 - Fonon DSS (Display and Semiconductor Systems), a division of Fonon Technology International, the world renowned inventor and manufacturer of Zero Width Laser Cutting Technology™, announced today the release of the F 250 GL laser separation tool for scribing generation 8 and higher sized glass used in the flat panel display industry and photovoltaic industries.

Fonon Technology International discovered and patented the Zero Width Laser Cutting Technology™ (ZWCT™) method. This method splits materials at the molecular level with tremendous speed, no material loss and no chips or other debris associated with conventional scribe and break techniques.

Incorporating this technology into a laser separation tool for scribing generation 8 and higher sized glass used in the flat panel display and photovoltaic industries, Fonon DSS developed the F 250 GL. This latest generation technology incorporates a mode selective resonator and specialty gas mix range for changing wavelength during cutting making a robust manufacturing process that costs significantly less in comparison to mechanical scribing systems. The cost of mechanical scribing machinery increases as glass panel sizes do, whereas the cost for laser technology continues to decrease as panel sizes increase.

Alleviating the major problem with the conventional laser technology, the lack of control of the beam and heat spots which makes cutting large size glass unreliable and inefficient, the F 250 GL is the most proficient and reliable tool available on the market. The development of the F250 GL is a tremendous breakthrough in processing generation 8 and larger panels having developed a 65% more efficient and constant manufacturing process with the highest throughput possible for this large glass.

Overall, the F 250 GL technology-tool combination can improve quality, lower costs, and take business’ to the next level. Currently, no other company is prepared to offer the proper tools for cutting glass which can meet the stringent industry requirements. Additionally, this tool is now commercially available throughout the world for cutting glass with the highest edge quality and strength at a price lower than conventional mechanical scribers.

Fantom G8 Thin Glass Laser Scribing Machine

Lake Mary, Fl., January 20, 2009 - Fonon DSS (Display & Semiconductor Systems), a division of Fonon Technology International, the world renowned inventor and manufacturer of Zero Width Laser Cutting Technology™ has announced the latest innovation in laser scribing for the Flat Panel Display (FPD) Industry, the Fantom G8 thin glass laser scribing machine.

Demand for flat-panel displays is growing, for notebook computers, cell phones, digital organizers, Internet appliances, smart watches, medical devices, electronic books and even high-definition television sets. Meanwhile, flat panel display manufacturers are facing new challenges, processing ultra-thin and larger G8-G11 size panels, requiring the accuracy and speed which only a laser can provide.

Historically, the glass for flat panel displays was cut using diamond cutters. This technique requires an artists’ touch to complete this meticulousness labor. When working with panel sizes G5 and up and glass that is thinner than ever, it’s no longer humanly feasible to use diamond cutters due to the overall dimensions of the glass. Fonon DSS’ laser scribing machine, the Fantom G8, provides a low cost, high speed, solution for precision glass scribing.

The Fantom G8 utilizes Zero Width Laser Cutting Technology™ (ZWLCT™) which allows scribing applications to be processed with tremendous speed, no material loss, and no chips or other debris associated with conventional scribe and break techniques. The ZWLCT™ method for glass cutting is a non contact method that scribes glass on the molecular level. After performing this application, the human eye is unable to see any change in the properties of the glass; however, when applying a small amount of pressure, the glass will split along the scribe line. Following the split, the glass has no particular damage and the highest edge quality which one can safely run their finger over. Additionally, ZWLCT™ maintains the integrity of the glass, thus strengthening it.

“Manufacturers in Taiwan, Japan and Korea are now opening new factories to accommodate ultra thin and larger G8-G11 size panels,” Demitri Nikitin, CEO of Fonon DSS. “The Fantom G8 is ideal for these processes incorporating a new generation modular design laser and precision direct drive high resolution linear motion system forming a precision, stand alone, small foot print automatic tool which can be easily integrated into an inline system.”


About Fonon DSS: Adivision of Fonon Technology International, the world renowned inventor and manufacturer of Zero Width Laser Cutting Technology™, Fonon DSS focuses on the semiconductor and flat panel display industries utilizing the patented Zero Width Laser Cutting Technology™ (ZWLCT™) to create products with the highest level of precision. Fonon DSS provides state-of-the-art laser scribing, laser dicing and fiber laser marking solutions to customers in the Flat Panel Display (FPD), Semiconductor and Electronics industries throughout the world. For more information, visit http://www.fonondss.com or call 407-829-2613.